JPH0270457U - - Google Patents
Info
- Publication number
- JPH0270457U JPH0270457U JP15026188U JP15026188U JPH0270457U JP H0270457 U JPH0270457 U JP H0270457U JP 15026188 U JP15026188 U JP 15026188U JP 15026188 U JP15026188 U JP 15026188U JP H0270457 U JPH0270457 U JP H0270457U
- Authority
- JP
- Japan
- Prior art keywords
- ground pad
- semiconductor chip
- high frequency
- lead
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 238000002955 isolation Methods 0.000 claims 2
- 230000007257 malfunction Effects 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
Landscapes
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15026188U JPH0270457U (en]) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15026188U JPH0270457U (en]) | 1988-11-17 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270457U true JPH0270457U (en]) | 1990-05-29 |
Family
ID=31423247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15026188U Pending JPH0270457U (en]) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270457U (en]) |
-
1988
- 1988-11-17 JP JP15026188U patent/JPH0270457U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0270457U (en]) | ||
| JPS62123744A (ja) | 半導体装置 | |
| JPS63253635A (ja) | 半導体装置 | |
| JPS6338328U (en]) | ||
| JPH0719148Y2 (ja) | マイクロ波回路用パッケージ | |
| JP2514430Y2 (ja) | ハイブリッドｉｃ | |
| JPS61153374U (en]) | ||
| JPS58109254U (ja) | フエ−スダウン接続形チツプ用チツプキヤリヤ− | |
| JPH01205457A (ja) | システム化半導体装置 | |
| JPH05267540A (ja) | 半導体素子の実装構造 | |
| JPS63187330U (en]) | ||
| JPS5945929U (ja) | 半導体素子の実装構造 | |
| JPS63307751A (ja) | 半導体集積回路装置 | |
| JPH0176062U (en]) | ||
| JPS6122362U (ja) | 混成集積回路 | |
| JPS63164245U (en]) | ||
| JPS5989551U (ja) | 半導体集積回路装置 | |
| JPS63145343U (en]) | ||
| JPS59121841U (ja) | Ｉｃチツプ用パツケ−ジ | |
| JPS60179043U (ja) | 半導体装置 | |
| JPS6052634U (ja) | 半導体装置 | |
| JPS59185833U (ja) | 半導体装置 | |
| JPS6081664U (ja) | 集積回路パツケ−ジ | |
| JPH0567646A (ja) | 半導体集積回路装置 | |
| JPH04164340A (ja) | 半導体集積回路 |